2. Ceramic grinding wheel

Ceramic bond diamond grinding wheel has the very high abrasion resistance, especially in the mill is very hard and brittle workpiece when the most obvious; Small grinding force, grinding temperature is low; Grinding of high accuracy and good surface quality of workpiece, the shape of the workpiece stability is good. Therefore ceramic bond diamond grinding wheel in grinding processing of some special materials such as ceramic, has more obvious advantages, is considered to be high speed, high efficiency, high precision, low grinding cost, low environmental pollution of high-performance abrasive. Based on the above advantages of ceramic grinding wheel bond diamond grinding wheel, the emergence of the ceramic binder grinding wheel is widely used in wafer (semiconductor wafers and solar wafers), diamond compact, polycrystalline diamond, diamond tool, cubic boron nitride, tungsten steel (carbide), new type of engineering structural ceramics, diamond, precious stones, crystal, rare earth materials (magnetic material) contour machining of hard brittle materials.

Specification: ceramic bond diamond grinding wheel:

170 * 14 * 32 * 10

32 * 160 * 10 * 10